ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,069, issued on July 14, was assigned to VITESCO TECHNOLOGIES GMBH (Regensburg, Germany). "Sensing symmetrical and asymmetrical insulation f... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,070, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "System for determining transistor o... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,071, issued on July 14, was assigned to MICROTESTERS LLC (Cheyenne, Wyo.). "System and method for measuring RDSon, RDSoff and current colla... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,072, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Substrate inspection apparatus and method of... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,073, issued on July 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor wafer" was invented by Wei Zhong L... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,074, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Method for predicting defect in semiconducto... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,075, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Configuring a fault-sensing ring oscillator ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,076, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "High voltage integrated circuit testing interface assembly" was i... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,077, issued on July 14. "Mass-interconnect engaging device" was invented by Jeffery P. Stowers (Mt. Sidney, Va.) and Benjamin T. Ailinger (... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,078, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Procedure for making on-die-parametric measurements of circuit de... Read More